Vacuum-packaged micro fuel reformer for high thermal efficiency and low package temperature

A. Kasuga; S. Tanaka; M. Esashi

doi:10.1109/MEMSYS.2008.4443819

Vacuum-packaged micro fuel reformer for high thermal efficiency and low package temperature

A. Kasuga, S. Tanaka, M. Esashi

ENG - Robotics

Tohoku University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Citations (Scopus)

Abstract

A fully-microfabricated wafer-level vacuum package of a micro fuel reformer was designed, fabricated and tested. For thermal insulation, a high-temperature reactor is suspended by microfabricated tubes, in which fuel and reformed gas flow, and is vacuum-packaged by anodic bonding. Conductive heat loss through air in the package was investigated by making the packaging pressure as a parameter. The measured heat loss is 1.2 W at a reforming temperature of 240°C, showing a potential to realize a micro fuel reformer with a thermal efficiency of 75%. Also, the temperature of the package outside is as low as 60°C, which is enough to install the micro fuel reformer in portable electronics.

Original language	English
Title of host publication	MEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems
Pages	968-971
Number of pages	4
DOIs	https://doi.org/10.1109/MEMSYS.2008.4443819
Publication status	Published - 2008
Event	21st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2008 Tucson - Tucson, AZ, United States Duration: 2008 Jan 13 → 2008 Jan 17

Publication series

Name	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)	1084-6999

Conference

Conference	21st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2008 Tucson
Country/Territory	United States
City	Tucson, AZ
Period	08/1/13 → 08/1/17

Access to Document

10.1109/MEMSYS.2008.4443819

Cite this

Kasuga, A., Tanaka, S., & Esashi, M. (2008). Vacuum-packaged micro fuel reformer for high thermal efficiency and low package temperature. In MEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems (pp. 968-971). Article 4443819 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMSYS.2008.4443819

@inproceedings{0d163a4655c14d308b66f2d1a6e90909,

title = "Vacuum-packaged micro fuel reformer for high thermal efficiency and low package temperature",

abstract = "A fully-microfabricated wafer-level vacuum package of a micro fuel reformer was designed, fabricated and tested. For thermal insulation, a high-temperature reactor is suspended by microfabricated tubes, in which fuel and reformed gas flow, and is vacuum-packaged by anodic bonding. Conductive heat loss through air in the package was investigated by making the packaging pressure as a parameter. The measured heat loss is 1.2 W at a reforming temperature of 240°C, showing a potential to realize a micro fuel reformer with a thermal efficiency of 75%. Also, the temperature of the package outside is as low as 60°C, which is enough to install the micro fuel reformer in portable electronics.",

author = "A. Kasuga and S. Tanaka and M. Esashi",

year = "2008",

doi = "10.1109/MEMSYS.2008.4443819",

language = "English",

isbn = "9781424417933",

series = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

pages = "968--971",

booktitle = "MEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems",

note = "21st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2008 Tucson ; Conference date: 13-01-2008 Through 17-01-2008",

}

Kasuga, A, Tanaka, S & Esashi, M 2008, Vacuum-packaged micro fuel reformer for high thermal efficiency and low package temperature. in MEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems., 4443819, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), pp. 968-971, 21st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2008 Tucson, Tucson, AZ, United States, 08/1/13. https://doi.org/10.1109/MEMSYS.2008.4443819

Vacuum-packaged micro fuel reformer for high thermal efficiency and low package temperature. / Kasuga, A.; Tanaka, S.; Esashi, M.
MEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems. 2008. p. 968-971 4443819 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Vacuum-packaged micro fuel reformer for high thermal efficiency and low package temperature

AU - Kasuga, A.

AU - Tanaka, S.

AU - Esashi, M.

PY - 2008

Y1 - 2008

N2 - A fully-microfabricated wafer-level vacuum package of a micro fuel reformer was designed, fabricated and tested. For thermal insulation, a high-temperature reactor is suspended by microfabricated tubes, in which fuel and reformed gas flow, and is vacuum-packaged by anodic bonding. Conductive heat loss through air in the package was investigated by making the packaging pressure as a parameter. The measured heat loss is 1.2 W at a reforming temperature of 240°C, showing a potential to realize a micro fuel reformer with a thermal efficiency of 75%. Also, the temperature of the package outside is as low as 60°C, which is enough to install the micro fuel reformer in portable electronics.

AB - A fully-microfabricated wafer-level vacuum package of a micro fuel reformer was designed, fabricated and tested. For thermal insulation, a high-temperature reactor is suspended by microfabricated tubes, in which fuel and reformed gas flow, and is vacuum-packaged by anodic bonding. Conductive heat loss through air in the package was investigated by making the packaging pressure as a parameter. The measured heat loss is 1.2 W at a reforming temperature of 240°C, showing a potential to realize a micro fuel reformer with a thermal efficiency of 75%. Also, the temperature of the package outside is as low as 60°C, which is enough to install the micro fuel reformer in portable electronics.

UR - http://www.scopus.com/inward/record.url?scp=50149115794&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=50149115794&partnerID=8YFLogxK

U2 - 10.1109/MEMSYS.2008.4443819

DO - 10.1109/MEMSYS.2008.4443819

M3 - Conference contribution

AN - SCOPUS:50149115794

SN - 9781424417933

T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

SP - 968

EP - 971

BT - MEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems

T2 - 21st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2008 Tucson

Y2 - 13 January 2008 through 17 January 2008

ER -

Kasuga A, Tanaka S, Esashi M. Vacuum-packaged micro fuel reformer for high thermal efficiency and low package temperature. In MEMS 2008 Tucson - 21st IEEE International Conference on Micro Electro Mechanical Systems. 2008. p. 968-971. 4443819. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). doi: 10.1109/MEMSYS.2008.4443819

Vacuum-packaged micro fuel reformer for high thermal efficiency and low package temperature

Abstract

Publication series

Conference

Access to Document

Other files and links

Fingerprint

Cite this