Variability origins of parasitic resistance in finFETs with silicided source/drain

Takashi Matsukawa, Yongxun Liu, Kazuhiko Endo, Junichi Tsukada, Yuki Ishikawa, Hiromi Yamauchi, Shinichi O'Uchi, Kunihiro Sakamoto, Meishoku Masahara

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15 Citations (Scopus)


Origins of parasitic resistance R para fluctuation were investigated by a measurement-based analysis for fin-shaped FETs (FinFETs) with NiSi in the source/drain (S/D). Fluctuation in the extension resistance R ext reflecting fin thickness T fin fluctuation is negligible for the sufficiently small thickness of the sidewall spacer. Although the NiSi incorporation in the S/D reduces R para on average, it causes additional fluctuation of R para. Analyzing the correlation of the R para fluctuation with the fluctuation in T fin and the lateral growth of NiSi, the dominant origin of the R para fluctuation is specified to be the NiSi/n +-Si contact resistance.

Original languageEnglish
Article number6151016
Pages (from-to)474-476
Number of pages3
JournalIEEE Electron Device Letters
Issue number4
Publication statusPublished - 2012 Apr


  • Fin-shaped FET (FinFET)
  • NiSi
  • parasitic resistance (R )
  • scaling
  • source/drain (S/D)
  • variability


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