@inproceedings{4467ff9ffc8642b0b1a5633be922d3a3,
title = "Varifocal mirror integrated with scanner using wafer bonding technology",
abstract = "The integration of a varifocal mirror with a scanner using wafer bonding technology is presented. The wafer bonding technology enables us to enlarge the design possibility. A 2 mm diameter varifocal mirror is bonded on the scanner. The optical scanning angle is 7° at 3.59 kHz. The focal length changes from infinity to 139 mm.",
keywords = "Micro-mirror, Scanner, Varifocal mirror, Wafer bonding",
author = "Kenta Nakazawa and Takashi Sasaki and Hiromasa Furuta and Jiro Kamiya and Hideki Sasaki and Toshikazu Kamiya and Kazuhiro Hane",
year = "2016",
month = sep,
day = "13",
doi = "10.1109/OMN.2016.7565907",
language = "English",
series = "International Conference on Optical MEMS and Nanophotonics",
publisher = "IEEE Computer Society",
booktitle = "2016 International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Proceedings",
note = "21st International Conference on Optical MEMS and Nanophotonics, OMN 2016 ; Conference date: 31-07-2016 Through 04-08-2016",
}