Via-last/backside-via 3D integration using a visible-light laser debonding technique

T. Fukushima; M. Mariappan; J. C. Bea; H. Hashimoto; Y. Sato; M. Motoyoshi; K. W. Lee; M. Koyanagi

doi:10.1109/LTB-3D.2014.6886152

Via-last/backside-via 3D integration using a visible-light laser debonding technique

T. Fukushima, M. Mariappan, J. C. Bea, H. Hashimoto, Y. Sato, M. Motoyoshi, K. W. Lee, M. Koyanagi

ENG - Mechanical Systems Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

4 Citations (Scopus)

Abstract

A visible-light laser debonding technique is introduced for via-last/backside-via 3D integration. Temporary bonding of 12-inch wafers with a temporary glue and the subsequent wafer thinning processes give small TTV within 1 μm by using an auto-TTV functions. Cu-TSV daisy chains with TSV diameters of 5 μm are formed in 50-μm-thick thinned Si wafers.

Original language	English
Title of host publication	Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
Publisher	IEEE Computer Society
Pages	13
Number of pages	1
ISBN (Print)	9781479952618
DOIs	https://doi.org/10.1109/LTB-3D.2014.6886152
Publication status	Published - 2014
Event	2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 - Tokyo, Japan Duration: 2014 Jul 15 → 2014 Jul 16

Publication series

Name	Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014

Conference

Conference	2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
Country/Territory	Japan
City	Tokyo
Period	14/7/15 → 14/7/16

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10.1109/LTB-3D.2014.6886152

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Fukushima, T., Mariappan, M., Bea, J. C., Hashimoto, H., Sato, Y., Motoyoshi, M., Lee, K. W., & Koyanagi, M. (2014). Via-last/backside-via 3D integration using a visible-light laser debonding technique. In Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 (pp. 13). Article 6886152 (Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014). IEEE Computer Society. https://doi.org/10.1109/LTB-3D.2014.6886152

Fukushima, T. ; Mariappan, M. ; Bea, J. C. et al. / Via-last/backside-via 3D integration using a visible-light laser debonding technique. Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014. IEEE Computer Society, 2014. pp. 13 (Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014).

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title = "Via-last/backside-via 3D integration using a visible-light laser debonding technique",

abstract = "A visible-light laser debonding technique is introduced for via-last/backside-via 3D integration. Temporary bonding of 12-inch wafers with a temporary glue and the subsequent wafer thinning processes give small TTV within 1 μm by using an auto-TTV functions. Cu-TSV daisy chains with TSV diameters of 5 μm are formed in 50-μm-thick thinned Si wafers.",

author = "T. Fukushima and M. Mariappan and Bea, {J. C.} and H. Hashimoto and Y. Sato and M. Motoyoshi and Lee, {K. W.} and M. Koyanagi",

year = "2014",

doi = "10.1109/LTB-3D.2014.6886152",

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series = "Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014",

publisher = "IEEE Computer Society",

pages = "13",

booktitle = "Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014",

address = "United States",

note = "2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 ; Conference date: 15-07-2014 Through 16-07-2014",

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Fukushima, T, Mariappan, M, Bea, JC, Hashimoto, H, Sato, Y, Motoyoshi, M, Lee, KW & Koyanagi, M 2014, Via-last/backside-via 3D integration using a visible-light laser debonding technique. in Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014., 6886152, Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014, IEEE Computer Society, pp. 13, 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014, Tokyo, Japan, 14/7/15. https://doi.org/10.1109/LTB-3D.2014.6886152

Via-last/backside-via 3D integration using a visible-light laser debonding technique. / Fukushima, T.; Mariappan, M.; Bea, J. C. et al.
Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014. IEEE Computer Society, 2014. p. 13 6886152 (Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Via-last/backside-via 3D integration using a visible-light laser debonding technique

AU - Fukushima, T.

AU - Mariappan, M.

AU - Bea, J. C.

AU - Hashimoto, H.

AU - Sato, Y.

AU - Motoyoshi, M.

AU - Lee, K. W.

AU - Koyanagi, M.

PY - 2014

Y1 - 2014

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AB - A visible-light laser debonding technique is introduced for via-last/backside-via 3D integration. Temporary bonding of 12-inch wafers with a temporary glue and the subsequent wafer thinning processes give small TTV within 1 μm by using an auto-TTV functions. Cu-TSV daisy chains with TSV diameters of 5 μm are formed in 50-μm-thick thinned Si wafers.

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BT - Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014

PB - IEEE Computer Society

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Fukushima T, Mariappan M, Bea JC, Hashimoto H, Sato Y, Motoyoshi M et al. Via-last/backside-via 3D integration using a visible-light laser debonding technique. In Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014. IEEE Computer Society. 2014. p. 13. 6886152. (Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014). doi: 10.1109/LTB-3D.2014.6886152

Via-last/backside-via 3D integration using a visible-light laser debonding technique

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