Wafer level encapsulation of microsystems using glass frit bonding

R. Knechtel, M. Wiemer, J. Frömel

Research output: Contribution to journalArticlepeer-review

71 Citations (Scopus)

Abstract

This paper gives an introduction to glass frit wafer bonding, which is an universally useable technology for encapsulation of microsystems, especially surface micromechanical sensors on wafer level. After a process description, some mechanical as well as electrical characteristics of glass frit bonded wafers are discussed and applications are shown.

Original languageEnglish
Pages (from-to)468-472
Number of pages5
JournalMicrosystem Technologies
Volume12
Issue number5
DOIs
Publication statusPublished - 2006 Apr

Keywords

  • Encapsulation
  • Glass frit
  • Interface and material characterization
  • MEMS
  • Wafer bonding

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