TY - GEN
T1 - Wafer-level fabricated micro beam splitter based on 45-degree saw dicing of glass substrate
AU - Bargiel, S.
AU - Baranski, M.
AU - Passilly, N.
AU - Guichardaz, B.
AU - Herth, E.
AU - Gorecki, C.
AU - Jia, C.
AU - Fromel, J.
AU - Wiemer, M.
PY - 2013
Y1 - 2013
N2 - This work presents the development of an integrated micro-optical beam splitter that can be arranged in array, and based on saw-dicing of glass substrates. The latter allows a rapid and rather low-cost processing, and in addition leads to high compactness and possibility of wafer level alignments, suitable for vertically integrated imaging microinstruments. The device allowing additional out-of plane reflection for extraction of sensing beam can be as small as 1mm3.
AB - This work presents the development of an integrated micro-optical beam splitter that can be arranged in array, and based on saw-dicing of glass substrates. The latter allows a rapid and rather low-cost processing, and in addition leads to high compactness and possibility of wafer level alignments, suitable for vertically integrated imaging microinstruments. The device allowing additional out-of plane reflection for extraction of sensing beam can be as small as 1mm3.
KW - beam splitter
KW - dielectric mirror
KW - glass micromachining
KW - MOEMS
KW - Optical instrumentation
KW - saw dicing
KW - UV bonding
KW - vertical integration
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UR - http://www.scopus.com/inward/citedby.url?scp=84891705655&partnerID=8YFLogxK
U2 - 10.1109/Transducers.2013.6626821
DO - 10.1109/Transducers.2013.6626821
M3 - Conference contribution
AN - SCOPUS:84891705655
SN - 9781467359818
T3 - 2013 Transducers and Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013
SP - 534
EP - 537
BT - 2013 Transducers and Eurosensors XXVII
T2 - 2013 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013
Y2 - 16 June 2013 through 20 June 2013
ER -