Wafer-level fabrication of microcube-typed beam-splitters by saw-dicing of glass substrate

Maciej Baranski, Sylwester Bargiel, Nicolas Passilly, Blandine Guichardaz, Etienne Herth, Christophe Gorecki, Chenping Jia, Jörg Frömel, Maik Wiemer

Research output: Contribution to journalArticlepeer-review

15 Citations (Scopus)


This letter reports on the development of an integrated micro-optical beam splitter that can be array-arranged. The proposed wafer-level fabrication, based on 45° saw-dicing of glass substrates, allows rapid and low-cost processing. In particular, it leads to high compactness and possibility of wafer-level alignment/assembly, suitable for vertically integrated imaging micro-instruments. The device, including additional out-of plane reflection for extraction of sensing beam, can be as small as 1 mm3.

Original languageEnglish
Article number6657824
Pages (from-to)100-103
Number of pages4
JournalIEEE Photonics Technology Letters
Issue number1
Publication statusPublished - 2014 Jan 1


  • Optical beam splitting
  • Optical components
  • Optical devices fabrication


Dive into the research topics of 'Wafer-level fabrication of microcube-typed beam-splitters by saw-dicing of glass substrate'. Together they form a unique fingerprint.

Cite this