TY - GEN
T1 - Wafer-level MEMS package and its reliability issues
AU - Tanaka, Shuji
AU - Esashi, Masayoshi
PY - 2013
Y1 - 2013
N2 - This paper reviews wafer-level hermetic packaging technology using anodic bonding from several reliability points of view. First, reliability risk factors of high temperature, high voltage and electrochemical O2 generation during anodic bonding are discussed. Next, electrical interconnections through a hermetic package, i.e. electrical feedthrough, is discussed. The reliability of both hermetic sealing and electrical feedthrough must be simultaneously satisfied. A new wafer-level MEMS packaging material, anodically-bondable low temperature cofired ceramic (LTCC) wafer, is introduced, and its reliability data on hermetic sealing, electrical interconnection and flip-chip mounting on a printed circuit board (PCB) are described.
AB - This paper reviews wafer-level hermetic packaging technology using anodic bonding from several reliability points of view. First, reliability risk factors of high temperature, high voltage and electrochemical O2 generation during anodic bonding are discussed. Next, electrical interconnections through a hermetic package, i.e. electrical feedthrough, is discussed. The reliability of both hermetic sealing and electrical feedthrough must be simultaneously satisfied. A new wafer-level MEMS packaging material, anodically-bondable low temperature cofired ceramic (LTCC) wafer, is introduced, and its reliability data on hermetic sealing, electrical interconnection and flip-chip mounting on a printed circuit board (PCB) are described.
KW - Anodic bonding
KW - Electrical feedthrough
KW - Low temperature cofired ceramics (LTCC)
KW - Micro electro mechanical systems (MEMS)
KW - Wafer-level packaging
UR - http://www.scopus.com/inward/record.url?scp=84881008232&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84881008232&partnerID=8YFLogxK
U2 - 10.1109/IRPS.2013.6532047
DO - 10.1109/IRPS.2013.6532047
M3 - Conference contribution
AN - SCOPUS:84881008232
SN - 9781479901135
T3 - IEEE International Reliability Physics Symposium Proceedings
SP - 6B.1.1-6B.1.5
BT - 2013 IEEE International Reliability Physics Symposium, IRPS 2013
T2 - 2013 IEEE International Reliability Physics Symposium, IRPS 2013
Y2 - 14 April 2013 through 18 April 2013
ER -