TY - JOUR
T1 - Wet etching of amorphous TiO2 thin films using H 3PO4-H2O2 aqueous solution
AU - Okazaki, Sohei
AU - Ohhashi, Takuya
AU - Nakao, Shoichiro
AU - Hirose, Yasushi
AU - Hitosugi, Taro
AU - Hasegawa, Tetsuya
N1 - Copyright:
Copyright 2013 Elsevier B.V., All rights reserved.
PY - 2013/9
Y1 - 2013/9
N2 - We report on the wet etching of amorphous undoped and Nb-doped TiO2 thin films using H3PO4-H2O2 etching solution. The etching rate (R) showed a maximum at a H3PO4 concentration of approximately 50 wt% at 80 °C, suggesting that H2PO4 and/or H3O+ is responsible for the etching reaction. The addition of H2O2 to H3PO4 solution significantly enhanced R, and an optimized solution exhibited an R of 13 nm/min at 80 °C, which is one order of magnitude higher than that using H2SO4. These results demonstrate that H3PO4-H2O2 aqueous solution is an effective etchant for TiO2-based amorphous thin films.
AB - We report on the wet etching of amorphous undoped and Nb-doped TiO2 thin films using H3PO4-H2O2 etching solution. The etching rate (R) showed a maximum at a H3PO4 concentration of approximately 50 wt% at 80 °C, suggesting that H2PO4 and/or H3O+ is responsible for the etching reaction. The addition of H2O2 to H3PO4 solution significantly enhanced R, and an optimized solution exhibited an R of 13 nm/min at 80 °C, which is one order of magnitude higher than that using H2SO4. These results demonstrate that H3PO4-H2O2 aqueous solution is an effective etchant for TiO2-based amorphous thin films.
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U2 - 10.7567/JJAP.52.098002
DO - 10.7567/JJAP.52.098002
M3 - Article
AN - SCOPUS:84883857142
SN - 0021-4922
VL - 52
JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
IS - 9
M1 - 098002
ER -