Wetting characteristics of Sn-Ag-Cu solder on Pd-based metallic glass

Hiroshi Nishikawa, Krit WongPiromsarn, Hiroya Abe, Tadashi Takemoto, Mikio Fukuhara, Takeshi Wada, Akihisa Inoue

Research output: Contribution to journalArticlepeer-review

15 Citations (Scopus)


A feasibility study has been conducted to determine whether soldering process can be used for the joining of metallic glasses. The mechanical properties of metallic glasses are extremely attractive compared with conventional crystalline materials. In order to adopt bulk metallic glasses in a broader range of engineering applications, it is very important to establish appropriate joining processes of metallic glasses. During the joint of metallic glass, the most serious issue is the reformation of glassy phase at the high temperature area. Therefore, to avoid the recrystallization of glassy phase, the soldering process has been investigated to join metallic glasses. In this study, the spread test was mainly performed at 523 K for 60 s. Results showed that the Sn-3.0 mass%Ag-0.5 mass%Cu solder deposited on Pd-based metallic glass had better wetting characteristics than the Sn-57 mass%Bi and Sn-51 mass%In solders. The microstructure at the interface between Sn-3.0Ag-0.5Cu solder and Pd-based metallic glass was analyzed by scanning electron microscopy. It was clear that the intermetallic compound, PdSn4 phase, was formed at the interface.

Original languageEnglish
Pages (from-to)124-127
Number of pages4
JournalMaterials Science and Engineering B: Solid-State Materials for Advanced Technology
Issue number1-3
Publication statusPublished - 2008 Feb 25


  • Interfacial reaction
  • Lead-free solder
  • Pd-based metallic glass
  • Wetting characteristic


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