TY - JOUR
T1 - Working fluid sealing method for vapor chamber type micro thermal diode
AU - Tsukamoto, Takashiro
AU - Sato, Koichi
AU - Tanaka, Shuji
N1 - Publisher Copyright:
© 2018 The Institute of Electrical Engineers of Japan.
PY - 2018
Y1 - 2018
N2 - This paper reports a method to encapsulate degassed working fluid in a vapor chamber type micro thermal diode. Degassing and sealing processes were sequentially done in a same vacuum chamber. The pressure in the device, measured by a zero-balance method, was as low as 7000 Pa, and the pressure was kept for at least 500 hours. The thermal resistance in the reverse heat flow mode was about 30% higher than that in the forward mode.
AB - This paper reports a method to encapsulate degassed working fluid in a vapor chamber type micro thermal diode. Degassing and sealing processes were sequentially done in a same vacuum chamber. The pressure in the device, measured by a zero-balance method, was as low as 7000 Pa, and the pressure was kept for at least 500 hours. The thermal resistance in the reverse heat flow mode was about 30% higher than that in the forward mode.
KW - Drop-wise condensation
KW - Micro heat management
KW - Power MEMS
KW - Thermal diode
KW - Vapor chamber
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U2 - 10.1541/ieejsmas.138.392
DO - 10.1541/ieejsmas.138.392
M3 - Article
AN - SCOPUS:85051022461
SN - 1341-8939
VL - 138
SP - 392
EP - 393
JO - IEEJ Transactions on Sensors and Micromachines
JF - IEEJ Transactions on Sensors and Micromachines
IS - 8
ER -