Igarashi, T.,
Kondo, K.,
Oka, T.,
Ikeda, M. &
Yoshida, S.,
2017 10月 20,
2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc.,
p. 151-156 6 p. 8078012. (IEEE International Symposium on Electromagnetic Compatibility).
研究成果: Conference contribution