@inproceedings{1a13622622c9477a812aaa97f62c7f7e,
title = "7-μm-thick NCF technology with low-height solder microbump bonding for 3D integration",
abstract = "High-density interconnections are highly required for 3D IC such as FPGA and image sensor applications. Fine-pitch interconnects using conventional solder microbumps are still required. To meet this requirements, low-height Cu/Sn microbumps are evaluated in this study. The thermal compression bonding with the low-height solder microbumps makes it challenging to fulfill high-viscous capillary underfill (CUF) into extremely small gaps between the chips stacked in layers. Here, we demonstrate to apply a 7-μm-thick non-conductive film (NCF) to flip-chip bonding with the low-height solder microbumps. Compared with a CUF, the electrical characterization such as electromigration (EM) and leakage current of microbump daisy chains with the ultra-thin NCF was investigated with temperature cycle test (TCT) and unbiased HAST.",
keywords = "3DIC, HAST, NCF, TCT, fine-pitch bonding, reliability, solder microbump",
author = "Yuki Miwa and Kousei Kumahara and Sungho Lee and Rui Liang and Hisashi Kino and Takafumi Fukushima and Tetsu Tanaka",
note = "Funding Information: ACKNOWLEDGMENT This work was performed in the Micro/Nano-machining research and education Center (MNC) and Jun-ichi Nishizawa Research Center at Tohoku University. We acknowledge This work was partially supported by JSPS KAKENHI Grant Number 18H04159 and 19KK0101. This work was also supported by VLSI Design and Education Center (VDEC), University of Tokyo, in collaboration with Cadence Design Systems. Publisher Copyright: {\textcopyright} 2020 IEEE.; 70th IEEE Electronic Components and Technology Conference, ECTC 2020 ; Conference date: 03-06-2020 Through 30-06-2020",
year = "2020",
month = jun,
doi = "10.1109/ECTC32862.2020.00230",
language = "English",
series = "Proceedings - Electronic Components and Technology Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1453--1458",
booktitle = "Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020",
}