Adhesion of Si and LiNbO₃ via Perhydropolysilazane for Photonic Substrate Fabrication

Engineering

• Photonics 100%
• Room Temperature 100%
• Bonding Process 50%
• Bonding Strength 50%
• Adhesive Layer 50%
• Silica (Sio2) 50%
• Hydrophilic Surface 50%
• Silicon Dioxide 50%

Material Science

• Silicon Dioxide 100%
• Surface Roughness 50%