抄録
Silicon MEMS as electrostatically levitated rotational gyroscope and 2D optical scanner, and wafer level packaged devices as integrated capacitive pressure sensor and MEMS switch are described. MEMS which use non-silicon materials as LTCC with electrical feedthrough, SiC (silicon carbide) and LiNbO3 for probe card for wafer-level burn-in test, mold for glass press molding and SAW wireless passive sensor respectively are also described.
| 本文言語 | English |
|---|---|
| ページ | 1325-1328 |
| ページ数 | 4 |
| 出版ステータス | Published - 2008 12月 1 |
| イベント | 15th International Display Workshops, IDW '08 - Niigata, Japan 継続期間: 2008 12月 3 → 2008 12月 5 |
Other
| Other | 15th International Display Workshops, IDW '08 |
|---|---|
| 国/地域 | Japan |
| City | Niigata |
| Period | 08/12/3 → 08/12/5 |
ASJC Scopus subject areas
- ハードウェアとアーキテクチャ
- 人間とコンピュータの相互作用
- 電子工学および電気工学
- 電子材料、光学材料、および磁性材料