Ar+H2 atmospheric-pressure plasma treatment for Au-Au bonding and influence of air exposure on surface contamination

Michitaka Yamamoto; Eiji Higurashi; Tadatomo Suga; Renshi Sawada; Toshihiro Itoh

doi:10.23919/LTB-3D.2017.7947460

Ar+H₂ atmospheric-pressure plasma treatment for Au-Au bonding and influence of air exposure on surface contamination

Michitaka Yamamoto, Eiji Higurashi, Tadatomo Suga, Renshi Sawada, Toshihiro Itoh

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

Au-Au room-temperature bonding in ambient air was demonstrated by applying argon and hydrogen gas mixture (Ar+H₂) atmospheric-pressure (AP) plasma treatment to surface activated bonding. Although conventional Ar low-pressure plasma treatment improved bonding strength only within air exposure for 1 hour, Ar+H2 AP plasma treatment improved the bonding strength even after air exposure for 10 hours.

本文言語	English
ホスト出版物のタイトル	Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
出版社	Institute of Electrical and Electronics Engineers Inc.
ページ	64
ページ数	1
ISBN（電子版）	9784904743034
DOI	https://doi.org/10.23919/LTB-3D.2017.7947460
出版ステータス	Published - 2017 6月 13
外部発表	はい
イベント	5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 - Tokyo, Japan 継続期間: 2017 5月 16 → 2017 5月 18

出版物シリーズ

名前	Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017

Other

Other	5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017
国/地域	Japan
City	Tokyo
Period	17/5/16 → 17/5/18

ASJC Scopus subject areas

電子工学および電気工学
産業および生産工学
電子材料、光学材料、および磁性材料
表面、皮膜および薄膜

文献へのアクセス

10.23919/LTB-3D.2017.7947460

他のファイルとリンク

引用スタイル

Yamamoto, M., Higurashi, E., Suga, T., Sawada, R., & Itoh, T. (2017). Ar+H₂ atmospheric-pressure plasma treatment for Au-Au bonding and influence of air exposure on surface contamination. In Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 (pp. 64). [7947460] (Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/LTB-3D.2017.7947460

Ar+H₂ atmospheric-pressure plasma treatment for Au-Au bonding and influence of air exposure on surface contamination. / Yamamoto, Michitaka; Higurashi, Eiji; Suga, Tadatomo その他.
Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. 64 7947460 (Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017).

研究成果: Conference contribution

Yamamoto, M, Higurashi, E, Suga, T, Sawada, R & Itoh, T 2017, Ar+H₂ atmospheric-pressure plasma treatment for Au-Au bonding and influence of air exposure on surface contamination. in Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017., 7947460, Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017, Institute of Electrical and Electronics Engineers Inc., pp. 64, 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017, Tokyo, Japan, 17/5/16. https://doi.org/10.23919/LTB-3D.2017.7947460

Yamamoto M, Higurashi E, Suga T, Sawada R, Itoh T. Ar+H₂ atmospheric-pressure plasma treatment for Au-Au bonding and influence of air exposure on surface contamination. In Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc. 2017. p. 64. 7947460. (Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017). doi: 10.23919/LTB-3D.2017.7947460

Yamamoto, Michitaka ; Higurashi, Eiji ; Suga, Tadatomo その他. / Ar+H₂ atmospheric-pressure plasma treatment for Au-Au bonding and influence of air exposure on surface contamination. Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017. Institute of Electrical and Electronics Engineers Inc., 2017. pp. 64 (Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017).

@inproceedings{89c0fbc97fff42ff83c38721f84f643a,

title = "Ar+H2 atmospheric-pressure plasma treatment for Au-Au bonding and influence of air exposure on surface contamination",

abstract = "Au-Au room-temperature bonding in ambient air was demonstrated by applying argon and hydrogen gas mixture (Ar+H2) atmospheric-pressure (AP) plasma treatment to surface activated bonding. Although conventional Ar low-pressure plasma treatment improved bonding strength only within air exposure for 1 hour, Ar+H2 AP plasma treatment improved the bonding strength even after air exposure for 10 hours.",

author = "Michitaka Yamamoto and Eiji Higurashi and Tadatomo Suga and Renshi Sawada and Toshihiro Itoh",

note = "Publisher Copyright: {\textcopyright} 2017 JSPS 191st Committee on Innovative Interface Bonding Technology.; 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017 ; Conference date: 16-05-2017 Through 18-05-2017",

year = "2017",

month = jun,

day = "13",

doi = "10.23919/LTB-3D.2017.7947460",

language = "English",

series = "Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "64",

booktitle = "Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017",

}

TY - GEN

T1 - Ar+H2 atmospheric-pressure plasma treatment for Au-Au bonding and influence of air exposure on surface contamination

AU - Yamamoto, Michitaka

AU - Higurashi, Eiji

AU - Suga, Tadatomo

AU - Sawada, Renshi

AU - Itoh, Toshihiro

PY - 2017/6/13

Y1 - 2017/6/13

N2 - Au-Au room-temperature bonding in ambient air was demonstrated by applying argon and hydrogen gas mixture (Ar+H2) atmospheric-pressure (AP) plasma treatment to surface activated bonding. Although conventional Ar low-pressure plasma treatment improved bonding strength only within air exposure for 1 hour, Ar+H2 AP plasma treatment improved the bonding strength even after air exposure for 10 hours.

AB - Au-Au room-temperature bonding in ambient air was demonstrated by applying argon and hydrogen gas mixture (Ar+H2) atmospheric-pressure (AP) plasma treatment to surface activated bonding. Although conventional Ar low-pressure plasma treatment improved bonding strength only within air exposure for 1 hour, Ar+H2 AP plasma treatment improved the bonding strength even after air exposure for 10 hours.

UR - http://www.scopus.com/inward/record.url?scp=85022220074&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85022220074&partnerID=8YFLogxK

U2 - 10.23919/LTB-3D.2017.7947460

DO - 10.23919/LTB-3D.2017.7947460

M3 - Conference contribution

AN - SCOPUS:85022220074

T3 - Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017

SP - 64

BT - Proceedings of 2017 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 5th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2017

Y2 - 16 May 2017 through 18 May 2017

ER -