@inproceedings{453f77584de54265ad4f02e53a74dbac,
title = "Au Flat Micro-Bump Arrays Fabricated by Transfer and Coining of Au Thin Films",
abstract = "Au flat micro-bump arrays that facilitate low-pressure Au-Au bonding were fabricated by the process based on Au thin film transfer and coining of Au hollow structure. High die shear strength was achieved between Au flat bumps and Au sputter films with a low bonding pressure of 10 MPa at 150°C.",
author = "Shintaro Goto and Kai Takeuchi and \{Huong Thu\}, \{Le Hac\} and Takashi Matsumae and Hideki Takagi and Yuichi Kurashima and Eiji Higurashi",
note = "Publisher Copyright: {\textcopyright} 2024 IEEE.; 8th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2024 ; Conference date: 30-10-2024 Through 01-11-2024",
year = "2024",
doi = "10.1109/LTB-3D64053.2024.10774140",
language = "English",
series = "2024 8th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2024",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2024 8th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2024",
address = "United States",
}