Au Flat Micro-Bump Arrays Fabricated by Transfer and Coining of Au Thin Films

Shintaro Goto
, Kai Takeuchi
, Le Hac Huong Thu
, Takashi Matsumae
, Hideki Takagi
, Yuichi Kurashima
, Eiji Higurashi

工学研究科・電子工学専攻

研究成果: 書籍の章/レポート/Proceedings › 会議への寄与 › 査読

Engineering