TY - JOUR
T1 - Compact triangulation sensor realized by bending Si wafer with optical elements at metal hinges
AU - Sasaki, Minora
AU - Endou, Satoshi
AU - Hane, Kazuhiro
PY - 2008
Y1 - 2008
N2 - A triangulation distance sensor is constructed bending the wafer with metal hinges. On the Si wafer, elements are pre-aligned at the planer condition using the photolithography. The position sensitive detector (PSD), mirror, and alignment pit for a ball lens are prepared. 3-sensor array is integrated in 20×17×10 mm3 size. Compared with our previous study using polymer, the metal hinge stabilizes the long-term performance and the process. Optical elements including LD chip are all included on the wafer. The demonstrated measurement range is 18-40 mm.
AB - A triangulation distance sensor is constructed bending the wafer with metal hinges. On the Si wafer, elements are pre-aligned at the planer condition using the photolithography. The position sensitive detector (PSD), mirror, and alignment pit for a ball lens are prepared. 3-sensor array is integrated in 20×17×10 mm3 size. Compared with our previous study using polymer, the metal hinge stabilizes the long-term performance and the process. Optical elements including LD chip are all included on the wafer. The demonstrated measurement range is 18-40 mm.
KW - Optical integration
KW - Prealignment
KW - Three-dimensional structure
KW - Triangulation distance sensor
KW - Wafer-bending
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U2 - 10.1541/ieejsmas.128.271
DO - 10.1541/ieejsmas.128.271
M3 - Article
AN - SCOPUS:73849120052
SN - 1341-8939
VL - 128
SP - 271-276+3
JO - IEEJ Transactions on Sensors and Micromachines
JF - IEEJ Transactions on Sensors and Micromachines
IS - 6
ER -