Complete restoration of the subsurface damages in single-crystalline silicon by laser irradiation

Engineering

• Subsurface 100%
• Laser Irradiation 100%
• Silicon Wafer 100%
• Dislocation 100%
• Silicon 100%
• Machining 50%
• Processing Method 50%
• Crystalline Silicon 50%
• Nanosecond 50%
• Seed Layer 50%
• Laser Energy 50%
• Energy Intensity 50%
• Surfaces 50%
• Activation 50%
• Melting 50%
• Diamond 50%