Deep reactive ion etching of Pyrex glass

Engineering

• Pyrex Glass 100%
• Deep Reactive Ion Etching 66%
• Energetic Ion 66%
• High Aspect Ratio 33%
• Smooth Surface 33%
• Etch Rate 33%
• Opening Width 33%
• Beryllium Ion 33%
• Thickness 33%
• Low Pressure 33%

Material Science

• Material 66%
• Liquid Films 33%
• Etching 33%