We studied the generation of dislocations during an ESD event by electrothermal and mechanical stress simulations based on analysis of critical mechanical stress for defect formation. We found the local thermal stress by ESD generates dislocations cooperatively with the residual mechanical stress in the Si substrate due to field oxidation. This means that process-induced mechanical stress is another key factor for controlling ESD performance, which will be important especially in low-power applications with severe leak requirements.
|Digest of Technical Papers - Symposium on VLSI Technology
|出版済み - 1995
|Proceedings of the 1995 Symposium on VLSI Technology - Kyoto, Jpn
継続期間: 1995 6月 6 → 1995 6月 8