@inproceedings{7ee2c1c7599a40f3be47aaf3087c3ae8,
title = "Efficient heat dissipation from {\ss}-Ga2O3film directly bonded on diamond substrate",
abstract = "A {\ss}-Ga2O3 film was directly bonded with a diamond heat spreader for efficient heat dissipation. Ga2O3 is expected as a future material for power electronics, but it has a heat dissipation problem due to its low thermal conductivity. We demonstrated that thermal resistance could be improved by direct bonding with a diamond heat spreader.",
keywords = "GaO, diamond, direct bonding, thermal management",
author = "T. Matsumae and Y. Kurashima and H. Takagi and H. Umezawa and H. Watanabe and T. Ito and E. Higurashi",
note = "Funding Information: This work was partially supported by JSPS KAKENHI Grant No. 20K15044. Publisher Copyright: {\textcopyright} 2022 Japan Institute of Electronics Packaging.; 21st International Conference on Electronics Packaging, ICEP 2022 ; Conference date: 11-05-2022 Through 14-05-2022",
year = "2022",
doi = "10.23919/ICEP55381.2022.9795505",
language = "English",
series = "2022 International Conference on Electronics Packaging, ICEP 2022",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "99--100",
booktitle = "2022 International Conference on Electronics Packaging, ICEP 2022",
address = "United States",
}