Etch stop process for fabrication of thin diaphragms in lithium niobate

Andrew B. Randles, Masayoshi Esashi, Shuji Tanaka

研究成果: ジャーナルへの寄稿学術論文査読

5 被引用数 (Scopus)

抄録

In this paper, we present a novel process for the fabrication of thin diaphragms in lithium niobate (LiNbO3) wafers for various sensor applications. The process uses a thermal inversion layer as an etch stop. Thermal inversion is a process which forms a layer with a poling direction opposite to that of the bulk crystal. The thermal inversion layer can be used as an etch stop because the etch rate on the +Z face in hydrofluoric acid is much slower than that on the -Z face. The thickness of the thermal inversion layer determines the thickness of the final diaphragm; diaphragms with thicknesses of 6 and 30 μm have been fabricated in Z-cut and 128°-Y-cut wafers, respectively.

本文言語英語
ページ(範囲)L1099-L1101
ジャーナルJapanese Journal of Applied Physics
46
45-49
DOI
出版ステータス出版済み - 2007 12月 14

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