Fabrication of miniaturized polarization sensors using flip-chip bonding with atmospheric-pressure plasma activation

So Ikeda, Michitaka Yamamoto, Eiji Higurashi, Tadatomo Suga, Toshiaki Oguchi

研究成果: 書籍の章/レポート/Proceedings会議への寄与査読

抄録

An ultra-small polarization sensor integrated with aluminum wire-grid polarizers has been developed for a compact optical rotary encoder. Flip-chip bonding using atmospheric-pressure plasma activation with mixed gas of Ar and H2 at a relatively low bonding temperature of 150 °C was applied to fabricate the integrated sensors. The feasibility of rotational angle measurement of a linear polarizer was demonstrated using the fabricated sensors.

本文言語英語
ホスト出版物のタイトルProceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
出版社IEEE Computer Society
ページ36
ページ数1
ISBN(印刷版)9781479952618
DOI
出版ステータス出版済み - 2014
イベント2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 - Tokyo, 日本
継続期間: 2014 7月 152014 7月 16

出版物シリーズ

名前Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014

会議

会議2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
国/地域日本
CityTokyo
Period14/7/1514/7/16

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