TY - GEN
T1 - Fabrication of miniaturized polarization sensors using flip-chip bonding with atmospheric-pressure plasma activation
AU - Ikeda, So
AU - Yamamoto, Michitaka
AU - Higurashi, Eiji
AU - Suga, Tadatomo
AU - Oguchi, Toshiaki
PY - 2014
Y1 - 2014
N2 - An ultra-small polarization sensor integrated with aluminum wire-grid polarizers has been developed for a compact optical rotary encoder. Flip-chip bonding using atmospheric-pressure plasma activation with mixed gas of Ar and H2 at a relatively low bonding temperature of 150 °C was applied to fabricate the integrated sensors. The feasibility of rotational angle measurement of a linear polarizer was demonstrated using the fabricated sensors.
AB - An ultra-small polarization sensor integrated with aluminum wire-grid polarizers has been developed for a compact optical rotary encoder. Flip-chip bonding using atmospheric-pressure plasma activation with mixed gas of Ar and H2 at a relatively low bonding temperature of 150 °C was applied to fabricate the integrated sensors. The feasibility of rotational angle measurement of a linear polarizer was demonstrated using the fabricated sensors.
UR - http://www.scopus.com/inward/record.url?scp=84906987367&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84906987367&partnerID=8YFLogxK
U2 - 10.1109/LTB-3D.2014.6886175
DO - 10.1109/LTB-3D.2014.6886175
M3 - Conference contribution
AN - SCOPUS:84906987367
SN - 9781479952618
T3 - Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
SP - 36
BT - Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
PB - IEEE Computer Society
T2 - 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
Y2 - 15 July 2014 through 16 July 2014
ER -