FoodSkin: Fabricating Edible Gold Leaf Circuits on Food Surfaces

Kunihiro Kato, Kaori Ikematsu, Hiromi Nakamura, Hinako Suzaki, Yuki Igarashi

研究成果: 書籍の章/レポート/Proceedings会議への寄与査読

抄録

We present FoodSkin, a technique for adding interactive elements to foods by implementing edible circuits on the surface of the food. The circuit is easily fabricated using commercially available materials. Existing approaches to enhance the eating experience, such as presenting an electrical taste by making food part of an electronic circuit, are challenging to apply to foods with low water content due to their low conductivity. Our technique enables the integration of dry foods into an electronic circuit and provides displaying (e.g., smell or taste) and sensing (e.g., eating activity) functionalities. We describe our fabrication technique with a library of food materials that we can utilize, evaluate the conductivity and adhesion of the gold-leaf traces, introduce demonstrative applications, and conclude with a workshop we conducted to evaluate the accessibility of our technique. FoodSkin enriches the design space for the computer-augmented eating experience by enabling the digital fabrication of electronics on versatile materials, surfaces, and shapes of foods.

本文言語英語
ホスト出版物のタイトルCHI 2024 - Proceedings of the 2024 CHI Conference on Human Factors in Computing Sytems
出版社Association for Computing Machinery
ISBN(電子版)9798400703300
DOI
出版ステータス出版済み - 2024 5月 11
イベント2024 CHI Conference on Human Factors in Computing Sytems, CHI 2024 - Hybrid, Honolulu, 米国
継続期間: 2024 5月 112024 5月 16

出版物シリーズ

名前Conference on Human Factors in Computing Systems - Proceedings

会議

会議2024 CHI Conference on Human Factors in Computing Sytems, CHI 2024
国/地域米国
CityHybrid, Honolulu
Period24/5/1124/5/16

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