Fully-filled, highly-reliable fine-pitch interposers with TSV aspect ratio >10 for future 3D-LSI/IC packaging
Murugesan Murugesan, Takafumi Fukushima, Kiyoharu Mori, Ai Nakamura, Yisang Lee, Makoto Motoyoshi, J. C. Bea, Shigeru Watariguchi, Mitsumasa Koyanagi
研究成果: Conference contribution
14
被引用数
(Scopus)