TY - GEN
T1 - Heterogeneous integration towards an ultra-compact and thin optical displacement microsensor
AU - Higurashi, Eiji
AU - Suga, Tadatomo
AU - Sawada, Renshi
PY - 2009
Y1 - 2009
N2 - This paper focuses on heterogeneous integration technology and its application in optical displacement microsensor. The integration is based on the Au-Au surface-activated bonding at a relatively low bonding temperature of 150°C. Applying this technique, an ultra-compact and thin optical displacement microsensor with three-dimensional structure (2.8 mm × 2.8 mm × 1 mm thick) was fabricated. The feasibility of displacement measurement based on grating interferometer was demonstrated using the prototype microsensor.
AB - This paper focuses on heterogeneous integration technology and its application in optical displacement microsensor. The integration is based on the Au-Au surface-activated bonding at a relatively low bonding temperature of 150°C. Applying this technique, an ultra-compact and thin optical displacement microsensor with three-dimensional structure (2.8 mm × 2.8 mm × 1 mm thick) was fabricated. The feasibility of displacement measurement based on grating interferometer was demonstrated using the prototype microsensor.
KW - Displacement measurement
KW - Grating interferometer
KW - Heterogeneous integration
KW - Low-temperature bonding
KW - Microsensor
UR - http://www.scopus.com/inward/record.url?scp=72749119727&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=72749119727&partnerID=8YFLogxK
U2 - 10.1109/ISOT.2009.5326083
DO - 10.1109/ISOT.2009.5326083
M3 - Conference contribution
AN - SCOPUS:72749119727
SN - 9781424442102
T3 - ISOT 2009 - International Symposium on Optomechatronic Technologies
SP - 209
EP - 214
BT - ISOT 2009 - International Symposium on Optomechatronic Technologies
T2 - ISOT 2009 - International Symposium on Optomechatronic Technologies
Y2 - 21 September 2009 through 23 September 2009
ER -