@inbook{d789a70caefb4b88952601e7c76f18d6,
title = "MEMS for practical applications",
abstract = "Silicon MEMS as electrostatically levitated rotational gyroscopes and 2D optical scanners, and wafer level packaged devices as integrated capacitive pressure sensors and MEMS switches are described. MEMS which use non-silicon materials as LTCC with electrical feedthrough, SiC and LiNbO3 for probe cards for wafer-level burn-in test, molds for glass press molding and SAW wireless passive sensors respectively are also described.",
keywords = "Gyroscope, Integrated sensor, LTCC, MEMS, Microphone, Optical scanner, Packaging, Pressure sensor, Probe card, SAW (Surface Acoustic Wave), SiC, Switch, Transponder",
author = "Masayoshi Esashi",
note = "Copyright: Copyright 2021 Elsevier B.V., All rights reserved.",
year = "2010",
doi = "10.1007/978-90-481-3807-4_3",
language = "English",
isbn = "9789048138050",
series = "NATO Science for Peace and Security Series B: Physics and Biophysics",
publisher = "Springer Verlag",
pages = "31--40",
booktitle = "Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators",
}