Multilithic 3D and Heterogeneous Integration Using Capillary Self-Assembly

研究成果: 書籍の章/レポート/Proceedings会議への寄与査読

1 被引用数 (Scopus)

抄録

We have worked on multichip-to-wafer (MC2W) 3D and heterogeneous integration and packaging using capillary self-assembly (CSA) with liquid droplets. In this work, microbump bonding and direct bonding technologies in face-up and/or facedown fashion are discussed for 3D-IC fabrication including 3D interconnect formation. Here 'non-transfer 3D stacking' like flip-chip bonding and 'transfer stacking' called reconfigure-wafer-to-wafer using self-assembly and electrostatic (SAE) carrier are explained. In addition, CSA application in flexible hybrid electronics (FHE) and micro-LED display is introduced.

本文言語英語
ホスト出版物のタイトル4th Electron Devices Technology and Manufacturing Conference, EDTM 2020 - Proceedings
出版社Institute of Electrical and Electronics Engineers Inc.
ISBN(電子版)9781728125381
DOI
出版ステータス出版済み - 2020 4月
イベント4th Electron Devices Technology and Manufacturing Conference, EDTM 2020 - Penang, マレーシア
継続期間: 2020 4月 62020 4月 21

出版物シリーズ

名前4th Electron Devices Technology and Manufacturing Conference, EDTM 2020 - Proceedings

会議

会議4th Electron Devices Technology and Manufacturing Conference, EDTM 2020
国/地域マレーシア
CityPenang
Period20/4/620/4/21

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