Multilithic 3D and Heterogeneous Integration Using Capillary Self-Assembly

Engineering

• Integration 50%
• Fabrication 25%
• Liquid Droplet 25%
• Electrostatics 25%
• Integrated Circuit 25%
• Chip Bonding 25%
• Bonding Technology 25%
• Direct Bonding 25%
• Applications 25%
• Hybrid 25%
• Interconnects 25%

Material Science

• Self Assembly 100%
• Electronics 50%

Chemistry

• Application 25%
• IC 25%