Multiwavelength DFB-LD array module using self-aligned solder bump bonding

N. Suzuki, Y. Muroya, J. Sasaki, H. Yamada, T. Torikai

研究成果: ジャーナルへの寄稿会議記事査読

2 被引用数 (Scopus)


Eight-wavelength 1.55-μm DFB-LD array modules with 1.6-nm wavelength spacing have been made by self-aligned assembly using a stripe-type solder bump flip-chip bonding, and the fiber output optical power for each channel was greater than -20 dBm. These modules are attractive low-cost multiwavelength light sources for use in WDM systems.

ジャーナルIEE Conference Publication
448 /2
出版ステータス出版済み - 1997
イベントProceedings of the 1997 11th International Conference on Integrated Optics and Optical Fibre Communications and 23rd European Conference on Optical Communications, IOOC-ECOC'97. Part 2 (of 5) -
継続期間: 1997 9月 221997 9月 25


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