Nanocomposite epoxy resin for SiC module

Kenji Okamoto, Yuji Takematsu, Miyako Hitomi, Yoshinari Ikeda, Yoshikazu Takahashi

研究成果: Conference contribution

3 被引用数 (Scopus)

抄録

There is a demand to improve the thermal stability of epoxy molding resins used in the power module of SiC power chips operating at temperatures of 200°C or more. This paper describes a technique for increasing the thermal stability of the resin by decreasing molecular motion through the addition of nanofiller. The experimental results showed that the glass transition temperature (Tg) of the epoxy resin increased by approximately 30°C when the silica nanofiller was added. The epoxy resin added nanofiller was investigated in order to achieve the operation temperature 200°C of power module.

本文言語English
ホスト出版物のタイトルProceedings - 2011 IMAPS International Conference on High Temperature Electronics Network, HiTEN 2011
ページ196-200
ページ数5
出版ステータスPublished - 2011 12月 1
外部発表はい
イベント2011 IMAPS International Conference on High Temperature Electronics Network, HiTEN 2011 - Oxford, United Kingdom
継続期間: 2011 7月 182011 7月 20

出版物シリーズ

名前Proceedings - 2011 IMAPS International Conference on High Temperature Electronics Network, HiTEN 2011

Other

Other2011 IMAPS International Conference on High Temperature Electronics Network, HiTEN 2011
国/地域United Kingdom
CityOxford
Period11/7/1811/7/20

ASJC Scopus subject areas

  • 電子工学および電気工学

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