TY - GEN
T1 - Next-gen IGBT module structure for hybrid vehicle with high cooling performance and high temperature operation
AU - Gohara, Hiromichi
AU - Nishimura, Yoshitaka
AU - Morozumi, Akira
AU - Dietrich, Peter
AU - Zuki, Eiji Mochi
AU - Takahashi, Yoshikazu
PY - 2014/1/1
Y1 - 2014/1/1
N2 - Trends of the Power module for hybrid vehicle are high effective, downsizing, lightweight and higher reliability. To achieve these requirements, IGBT module needs low thermal resistance and high operating temperature. In this paper, we developed new technologies. One technology is the cooling structures which has a direct liquid cooling structure with a solder-joined aluminum heat sink. The module achieves a 30-% volume reduction and a 60-% weight reduction compared to our conventional models. A heat sink with high cooling capacity and a high-strength solder were newly developed to establish the structure. And other is the maximum junction temperature, Tjmax = 175°C continuous operation with automotive required quality. We have applied these new technologies to the next-gen IGBT module for hybrid vehicle application.
AB - Trends of the Power module for hybrid vehicle are high effective, downsizing, lightweight and higher reliability. To achieve these requirements, IGBT module needs low thermal resistance and high operating temperature. In this paper, we developed new technologies. One technology is the cooling structures which has a direct liquid cooling structure with a solder-joined aluminum heat sink. The module achieves a 30-% volume reduction and a 60-% weight reduction compared to our conventional models. A heat sink with high cooling capacity and a high-strength solder were newly developed to establish the structure. And other is the maximum junction temperature, Tjmax = 175°C continuous operation with automotive required quality. We have applied these new technologies to the next-gen IGBT module for hybrid vehicle application.
UR - http://www.scopus.com/inward/record.url?scp=84906568074&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84906568074&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:84906568074
SN - 9783800736034
T3 - PCIM Europe Conference Proceedings
SP - 1187
EP - 1194
BT - Proceedings - PCIM Europe 2014
PB - Mesago PCIM GmbH
T2 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, PCIM Europe 2014
Y2 - 20 May 2014 through 22 May 2014
ER -