Optimization of Ag Thin Film Thickness with a Capping Layer for Ag-Ag Surface Activated Bonding

Yuanhao Cai
, Kai Takeuchi
, Miyuki Uomoto
, Takehito Shimatsu
, Eiji Higurashi

Tohoku University

研究成果: 書籍の章/レポート/Proceedings › 会議への寄与 › 査読

Material Science

Engineering