TY - GEN
T1 - Patterning high aspect silicon pillars on cantilever by metal assisted chemical etching for humidity sensing
AU - Van Toan, Nguyen
AU - Toda, Masaya
AU - Hokama, Takumi
AU - Ono, Takahito
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017/2/23
Y1 - 2017/2/23
N2 - Pillars formed by metal assisted chemical etching (MACE) process as a post process on a silicon cantilever are presented in this work. Although the cantilever is very fragile, the patterning of the pillar structures on the cantilever have been successfully demonstrated. The high aspect silicon pillar structures from 20 to 40 with smooth surfaces and vertically etched shapes on the cantilever are formed by MACE. In addition, silicon cantilever with high aspect ratio pillars on its surface is proposed for humidity sensing application. The humidity sensing utilize the principle that the pillars stack together based upon the condensation behavior of water vapor on their surfaces.
AB - Pillars formed by metal assisted chemical etching (MACE) process as a post process on a silicon cantilever are presented in this work. Although the cantilever is very fragile, the patterning of the pillar structures on the cantilever have been successfully demonstrated. The high aspect silicon pillar structures from 20 to 40 with smooth surfaces and vertically etched shapes on the cantilever are formed by MACE. In addition, silicon cantilever with high aspect ratio pillars on its surface is proposed for humidity sensing application. The humidity sensing utilize the principle that the pillars stack together based upon the condensation behavior of water vapor on their surfaces.
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U2 - 10.1109/MEMSYS.2017.7863639
DO - 10.1109/MEMSYS.2017.7863639
M3 - Conference contribution
AN - SCOPUS:85015735033
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 1232
EP - 1235
BT - 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems, MEMS 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 30th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2017
Y2 - 22 January 2017 through 26 January 2017
ER -