抄録
Micro-fabrication combining stereo-lithography with reactive ion etching is proposed. Three-dimensional polymer structures smaller than 1 mm are fabricated on silicon wafer by He-Cd (325.0 nm) laser stereo-lithography. Using the polymer structure having a high-aspect ratio as resist for deep reactive ion etching, the microstructure is transferred to the silicon substrate with an etching ratio of 0.5. The proposed technique has been demonstrated by the fabrication of lens-like structures.
本文言語 | English |
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ページ(範囲) | 1411-1416 |
ページ数 | 6 |
ジャーナル | Microsystem Technologies |
巻 | 13 |
号 | 8-10 |
DOI | |
出版ステータス | Published - 2007 5月 1 |
ASJC Scopus subject areas
- 電子材料、光学材料、および磁性材料
- 凝縮系物理学
- ハードウェアとアーキテクチャ
- 電子工学および電気工学