Self-Assembly Based 3D and Heterointegration

Takafumi Fukushima, Jicheol Bea

研究成果: 書籍の章/レポート/Proceedings査読

1 被引用数 (Scopus)

抄録

In order to improve assembly throughput and production yield in chip-on-wafer 3D integration, surface tension-driven chip self-assembly technologies have been proposed. Small volume of liquid droplets can precisely assemble a large number of known good dies on host wafers at the sub-micrometer accuracy level. Here, impact of several parameters on alignment accuracies are described. In addition, this chapter introduces interconnect technologies of self-assembled chips in a face-up or face-down bonding fashion to the host wafers with metal microbumps.

本文言語英語
ホスト出版物のタイトル3D Process Technology
出版社Wiley-Blackwell
ページ325-334
ページ数10
3
ISBN(電子版)9783527670109
ISBN(印刷版)9783527334667
DOI
出版ステータス出版済み - 2014 7月 21

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