Simultaneous molding and low-temperature bonding of Au microstructures for fabrication of micromirrors on non-silicon substrates

Seiya Matsuoka, Eiji Higurashi, Tadatomo Suga, Renshi Sawada

研究成果: Conference contribution

抄録

In order to realize micromirrors on non-silicon substrates, low-temperature bonding method of Au microrods (diameter: 100-130 μm) using glass molds is presented. First, a target substrate with an Au thin film and the Au microrod were surface activated using hydrogen plasma. Then, the Au microrod was pressed against the target substrate using the glass mold at 150 °C in ambient air. The Au microrod was plastically deformed and smooth surface (11 nm rms) was successfully fabricated on the Au microrod. Using the glass as the mold material, molding and Au-Au bonding were performed in one processing step.

本文言語English
ホスト出版物のタイトル2016 International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Proceedings
出版社IEEE Computer Society
ISBN(電子版)9781509010356
DOI
出版ステータスPublished - 2016 9月 13
外部発表はい
イベント21st International Conference on Optical MEMS and Nanophotonics, OMN 2016 - Singapore, Singapore
継続期間: 2016 7月 312016 8月 4

出版物シリーズ

名前International Conference on Optical MEMS and Nanophotonics
2016-September
ISSN(印刷版)2160-5033
ISSN(電子版)2160-5041

Other

Other21st International Conference on Optical MEMS and Nanophotonics, OMN 2016
国/地域Singapore
CitySingapore
Period16/7/3116/8/4

ASJC Scopus subject areas

  • ハードウェアとアーキテクチャ
  • 電子工学および電気工学
  • 電子材料、光学材料、および磁性材料

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