TY - GEN
T1 - Triple-Stacked Wafer-to-Wafer Hybrid Bonding for 3D Structured Image Sensors
AU - Honda, Yuki
AU - Goto, Masahide
AU - Watabe, Toshihisa
AU - Nanba, Masakazu
AU - Iguchi, Yoshinori
AU - Saraya, Takuya
AU - Kobayashi, Masaharu
AU - Higurashi, Eiji
AU - Toshiyoshi, Hiroshi
AU - Hiramoto, Toshiro
N1 - Publisher Copyright:
© 2019 JSPS 191st Committee on Innovative Interface Bonding Technology.
PY - 2019/5
Y1 - 2019/5
N2 - We propose a triple-stacked wafer-to-wafer hybrid bonding technique for image sensor 3D integration by repeating (1) embedment of gold electrode sites, (2) Au/SiO bonding with a thin Si layer in between, and (3) subsequent lost-wafer processes.
AB - We propose a triple-stacked wafer-to-wafer hybrid bonding technique for image sensor 3D integration by repeating (1) embedment of gold electrode sites, (2) Au/SiO bonding with a thin Si layer in between, and (3) subsequent lost-wafer processes.
UR - https://www.scopus.com/pages/publications/85068367214
UR - https://www.scopus.com/inward/citedby.url?scp=85068367214&partnerID=8YFLogxK
U2 - 10.23919/LTB-3D.2019.8735257
DO - 10.23919/LTB-3D.2019.8735257
M3 - Conference contribution
AN - SCOPUS:85068367214
T3 - Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
SP - 45
BT - Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
Y2 - 21 May 2019 through 25 May 2019
ER -