Variation of thermal stress in TSV structures caused by crystallinity of electroplated copper interconnections

Material Science

• Copper 100%
• Thin Films 50%
• Ruthenium 50%
• Lattice Mismatch 50%
• Residual Stress 50%
• Thermal Cycling 50%
• Material 50%
• Thermal Stability 25%
• Thermal Stress 25%
• Electroplating 25%