TY - JOUR
T1 - Vertical Diaphragm Electrostatic Actuator for a High Density Ink Jet Printer Head
AU - Norimatsu, Takayuki
AU - Tanaka, Shuji
AU - Esashi, Masayoshi
PY - 2005
Y1 - 2005
N2 - This paper describes the design, fabrication process and preliminaiy evaluation of an electrostatic ink jet printer head with vertical diaphragms in deep trenches. By adopting the novel structure where an ink cavity is surrounded by the vertical diaphragm, the footprint of each unit (40 μm×500 μm) becomes approximately one fifth as small as that of a conventional one. Such small footprint is advantageous in cost, resolution and printing speed. To make the vertical diaphragms, a 0.5 μm thick sacrificial thermally-oxidized layer and a 4.5 pm thick poly-silicon layer are sequentially formed in deep-reactive-ion-etched trenches, and then the sacrificial layer is etched away by fluoric acid. The nozzles are fabricated on a Pyrex glass substrate by femtosecond laser ablation, and the nozzle outside is covered with a water repellant Au/Pt/Ti layer. Impedance measurement found that the electrostatic gaps were in contact or closely approaching. This could be because the diaphragms buckled by compressive stress induced in low pressure chemical vapor deposition (LPCVD). Ink ejection was tried using commercially-available blue ink, but failed. The nozzles were covered with the ink, because the water repellant finish of the nozzle outside was not good.
AB - This paper describes the design, fabrication process and preliminaiy evaluation of an electrostatic ink jet printer head with vertical diaphragms in deep trenches. By adopting the novel structure where an ink cavity is surrounded by the vertical diaphragm, the footprint of each unit (40 μm×500 μm) becomes approximately one fifth as small as that of a conventional one. Such small footprint is advantageous in cost, resolution and printing speed. To make the vertical diaphragms, a 0.5 μm thick sacrificial thermally-oxidized layer and a 4.5 pm thick poly-silicon layer are sequentially formed in deep-reactive-ion-etched trenches, and then the sacrificial layer is etched away by fluoric acid. The nozzles are fabricated on a Pyrex glass substrate by femtosecond laser ablation, and the nozzle outside is covered with a water repellant Au/Pt/Ti layer. Impedance measurement found that the electrostatic gaps were in contact or closely approaching. This could be because the diaphragms buckled by compressive stress induced in low pressure chemical vapor deposition (LPCVD). Ink ejection was tried using commercially-available blue ink, but failed. The nozzles were covered with the ink, because the water repellant finish of the nozzle outside was not good.
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U2 - 10.1541/ieejsmas.125.350
DO - 10.1541/ieejsmas.125.350
M3 - Article
AN - SCOPUS:85024443973
SN - 1341-8939
VL - 125
SP - 350
EP - 354
JO - IEEJ Transactions on Sensors and Micromachines
JF - IEEJ Transactions on Sensors and Micromachines
IS - 8
ER -